Copper Nanoparticles Ink (Cu, Purity: 99.9 %, Diameter: 80-100nm)

Typical Properties
CAS	7440-50-8
Catalog	ACM7440508-79
Molecular Weight	63.55 g/mol
Boiling Point	2580 °C
Melting Point	1083.4 °C(lit.)
Flash Point	-23 °C
Purity	99.9 %
Density	8.92 g/cm3
Appearance	Liquid
Storage	2-8 °C
Color	Black
Composition	Cu
Concentration	< 5 % (Available as per Customer requirement)
Diameter	80-100 nm
pH	7.0±0.5
Precautions for use	This product is inert gas anti-static packaging, it should be sealed and stored in a dry and cool environment.
Quality Level	200
Shipping	Ambient Temperature
Solvent	Organic Solvent (DMF), IPA Ethanol, Water (ddH27O)

Overview

Description

Nano-copper colloidal particles are widely used in catalysis, magnetic fluid, lubrication and other fields because of their specific physical and chemical properties. Nano copper powder and colloidal copper are prepared by variable current laser ion beam gas phase method, which has large industrial output, spherical shape, uniform particle size, high crystallinity, high product purity, high surface activity, easy to disperse and industrial application.

Features

·Evenly dispersed, small particles
·Good compatibility, easy to disperse, easy to add a variety of systems
·Good system stability, reliable performance, safety and environmental protection
·High specific surface area, high loading, easy surface functionalization

Application

·Production of Microelectronic Devices
·Catalyst in the reaction process of carbon dioxide and hydrogen to methanol
·Conductive coating treatment on metal and non-metal surfaces
·Conductive paste, used as petroleum lubricant and pharmaceutical industry

Case Study

Flash Sintering Method of Antioxidant Copper Nanoparticle Inks for Flexible Inkjet Printing

Son Y H, et al. Thin Solid Films, 2018, 656, 61-67.

In order to overcome the problem that copper is easily oxidized, a vapor self-assembled multilayer film (VSAM) method was developed, using 1-octanethiol to coat the surface of copper nanoparticles to achieve more than 40 days of oxidation resistance. In this work, nanoinks made from 1-octanethiol-coated copper nanoparticles can be used for inkjet printing on polyimide substrates to form copper patterns. The pattern was then subjected to flash-lamp sintering, resulting in a resistivity of 2.4 × 10-7 Ω · m under optimal conditions.
Synthesis and inkjet printing of antioxidant copper nano-ink
· Synthesis of the 1-octanethiol-coated copper nano-ink: Copper nanoparticles were synthesized using the polyol method. They were then coated with 1-octanethiol using the VSAMs method, under the conditions of 5 min and six cycles at 4.0 × 10-6 Torr.
· Inkjet printing and flash-light sintering conditions: The 50 μm thick flexible polyimide substrate was cleaned with ethanol and pre-treated by plasma-enhanced chemical vapor deposition. The copper nano-ink was printed using an inkjet printer on the plasma-treated polyimide substrate.
· After patterning, the ink solvent was vaporized at room temperature. The 50 μm thick flexible polyimide substrate was cleaned with ethanol and pre-treated by plasma-enhanced chemical vapor deposition. Sintering is accomplished in two ways, including main sintering in a furnace and flash lamp sintering.