Copper Nanoparticles Ink (Cu, Purity: 99.9 %, Diameter: 5-10nm)

Typical Properties
CAS	7440-50-8
Catalog	ACM7440508-78
Molecular Weight	63.55 g/mol
Boiling Point	2580 °C
Melting Point	1083.4 °C(lit.)
Flash Point	-23 °C
Purity	99.9 %
Density	8.92 g/cm3
Appearance	Liquid
Color	Black
Composition	Cu
Concentration	3.2 g/L
Diameter	5-10 nm
pH	7.0±0.5
Precautions for use	This product is inert gas anti-static packaging, it should be sealed and stored in a dry and cool environment.
Quality Level	200
Shipping	Ambient Temperature
Solvent	Water

Overview

Description

Nano-copper colloidal particles are widely used in catalysis, magnetic fluid, lubrication and other fields because of their specific physical and chemical properties. Nano copper powder and colloidal copper are prepared by variable current laser ion beam gas phase method, which has large industrial output, spherical shape, uniform particle size, high crystallinity, high product purity, high surface activity, easy to disperse and industrial application.

Features

·Evenly dispersed, small particles
·Good compatibility, easy to disperse, easy to add a variety of systems
·Good system stability, reliable performance, safety and environmental protection
·High specific surface area, high loading, easy surface functionalization

Application

·Production of Microelectronic Devices
·Catalyst in the reaction process of carbon dioxide and hydrogen to methanol
·Conductive coating treatment on metal and non-metal surfaces
·Conductive paste, used as petroleum lubricant and pharmaceutical industry

Case Study

Copper Nanoparticle Ink Used in Drawing Conductive Patterns Directly on Paper Substrates

Li, Wei, et al. Journal of nanoparticle research, 2013, 15, 1-10.

Air-stable copper nanoparticles (Cu NPs) with an average diameter of 6.5 nm were synthesized and can be used to prepare nanocopper inks suitable for direct writing on photo paper. The smaller Cu NP size and enhanced air stability lead to increased electrical conductivity of the sintered Cu pattern. RFID antenna samples and decorative signs can be successfully prepared using this Cu NPs-based ink.
Preparation of copper patterns from Cu NPs
· For the preparation of the Cu conductive ink, the obtained Cu nanoparticles were dispersed in DI water and ethanol, and then glycerol and ethylene glycol were added as the binder. The solvent composition of Cu ink was water:ethanol:glycerol:ethylene glycol = 23:8:30.5:38.5 vol%. The Cu NPs were dispersed by ultrasonic treatment to obtain 60 wt% Cu NPs ink and used for drawing flexible printed patterns.
· Cu patterns were created by directly writing on ordinary photo paper using a roller pen loaded with the Cu NPs ink, which was injected into the empty pipe of the roller pen by a syringe. Here, a photo paper, which is porous and has a good graphomotor property as well as a low surface roughness, guarantees the flexibility of the substrate and excellent adsorption ability between the nano-Cu ink and the substrate. The written Cu pattern, together with the photo paper, was sintered in air at 80-160 °C for different times.