Copper Nanoparticles Ink (Cu, Purity: 99.9 %, Diameter: 100-150nm, Concentration: 30%)

Typical Properties
CAS	7440-50-8
Catalog	ACM7440508-77
Molecular Weight	63.55 g/mol
Boiling Point	2580 °C
Melting Point	1083.4 °C(lit.)
Flash Point	-23 °C
Purity	99.9 %
Density	8.92 g/cm3
Appearance	Liquid
Color	Off-white translucent
Composition	Cu
Concentration	30 %
Diameter	100-150 nm
pH	7.0±0.5
Precautions for use	It is recommended to add 3~4%, add it to the material and mix it evenly.
Quality Level	200
Shipping	Ambient Temperature
Solvent	Water

Overview

Description

Nano-copper colloidal particles are widely used in catalysis, magnetic fluid, lubrication and other fields because of their specific physical and chemical properties. Nano copper powder and colloidal copper are prepared by variable current laser ion beam gas phase method, which has large industrial output, spherical shape, uniform particle size, high crystallinity, high product purity, high surface activity, easy to disperse and industrial application.

Features

·Uniform particle size, good dispersibility, good compatibility
·White translucent appearance for a wide range of applications
·Strong bactericidal performance, the antibacterial rate can reach more than 99%, and the effect is lasting
·Excellent antiviral effect, the inactivation rate of coronavirus is over 99%
·Stable performance, after nano treatment, no oxidation, no precipitation, no discoloration

Application

·Production of Microelectronic Devices
·Catalyst in the reaction process of carbon dioxide and hydrogen to methanol
·Conductive coating treatment on metal and non-metal surfaces
·Conductive paste, used as petroleum lubricant and pharmaceutical industry

Case Study

Copper Nanoparticle Ink for Organic Electronic Devices

Polino G, et al. Organic electronics, 2016, 34, 130-138.

In the field of printed electronics, copper nanoparticle (Cu NPs) ink is the most promising cost-effective candidate to replace silver ink. In addition, the sintering process can be greatly accelerated through photonic sintering technology of copper-based conductive inks, while local high temperatures can be achieved in printed circuits without affecting the plastic substrate. Photonic sintering under optimized conditions led to high electrical conductivities (20% of the bulk Cu value), combined with a good adhesion to the substrate.
Performance evaluation of Cu NPs ink
· The inks were tested on different rigid and flexible substrates, namely: borosilicate glass and soda lime glass, polyethylene naphthalate (PEN) foil, and polyethylene terephthalate (PET) foil.
· Surface modification upon different substrates was performed using a UV-ozone setup PR100 e Ultra Violet Products (UVP) for 5 min. Nitrogen plasma treatments were performed using a PVA TePla 300 Microwave Plasma System for 2 min at 600 W, 2.54 GHz and under reduced pressure (0.6 mbar). The inkjet printing performances of the three inks were tested using a DMP 2830 Materials Printer.
· Sintering was performed in a two-step approach: The first step was a fast thermal pre-treatment in a Memmert hot air oven for 10 min at 80 °C or 5 min at 100 °C in air. Under these conditions, well dried samples were obtained, which were subjected to the second step, photonic flash sintering.