Copper Nanoparticles Ink (Cu, Purity: 99.9 %, Diameter: 100-150nm, Concentration: ≥1000 ppm)

Typical Properties
CAS	7440-50-8
Catalog	ACM7440508-76
Molecular Weight	63.55 g/mol
Boiling Point	2580 °C
Melting Point	1083.4 °C(lit.)
Flash Point	-23 °C
Purity	99.9 %
Density	8.92 g/cm3
Appearance	Liquid
Color	Yellow
Composition	Cu
Concentration	≥1000 ppm
Diameter	100-150 nm
pH	7.0±0.5
Precautions for use	It is recommended to add 10%, add it to the material and mix it evenly.
Quality Level	200
Shipping	Ambient Temperature
Solvent	Water

Overview

Description

Nano-copper colloidal particles are widely used in catalysis, magnetic fluid, lubrication and other fields because of their specific physical and chemical properties. Nano copper powder and colloidal copper are prepared by variable current laser ion beam gas phase method, which has large industrial output, spherical shape, uniform particle size, high crystallinity, high product purity, high surface activity, easy to disperse and industrial application.

Features

·The particles are uniform and the size is the same
·High copper purity, up to 99.9%
·Strong bactericidal effect, antibacterial rate of more than 99%
·Stable performance, after nano treatment, no oxidation

Application

·Production of Microelectronic Devices
·Catalyst in the reaction process of carbon dioxide and hydrogen to methanol
·Conductive coating treatment on metal and non-metal surfaces
·Conductive paste, used as petroleum lubricant and pharmaceutical industry

Case Study

Synthesis of Antioxidant Copper Nanoparticles for High-Performance Conductive Inks

Cheng C, et al. Journal of Materials Science: Materials in Electronics, 2017, 28, 13556-13564.

Nanocopper has great potential to replace expensive materials such as conductive nanosilver and nanogold in conductive inks. Copper nanoparticles (Cu NPs) were synthesized through chemical reduction method, with an average size of approximately 140 nm, and showed no signs of oxidation when stored at room temperature for 3 months. The synthesized copper nanoparticles can be easily dispersed into solvent to form copper nanoparticles ink. Cu NPs-based ink was coated on a flexible polyimide (PI) substrate and sintered in a muffle furnace. The results show that at a sintering temperature of 400°C, the resistivity of the copper film can be as low as 5.7 μΩ cm.
Preparation of copper conductive films
· First, copper nanoparticles were synthesized through a chemical reduction method, in which copper hydroxide was used as the precursor, L-ascorbic acid was used as the reducing agent, polyvinylpyrrolidone (PVP) was used as the capping agent and diethylene glycol (DEG) was used as the solvent.
· Then, to prepare copper conductive ink, Cu NPs were uniformly dispersed into ethanol through sonication for 30 min.
· Finally, the Cu NPs-based conductive ink was coated on the flexible polyimide (PI) substrate and sintered in a muffle furnace. The copper film was annealed in Muffle furnace with varying sintering temperature and time under Ar(96%)-H2(4%) gas mixture.