Copper Nanoparticles Ink (Cu, Purity: 99.9 %, Diameter: <100 nm)

Typical Properties
CAS	7440-50-8
Catalog	ACM7440508-75
Molecular Weight	63.55 g/mol
Boiling Point	2580 °C
Melting Point	1083.4 °C(lit.)
Flash Point	-23 °C
Purity	99.9 %
Density	8.92 g/cm3
Appearance	Liquid
Color	Dark red
Composition	Cu
Concentration	50/65 wt.%
Diameter	<100 nm
pH	7.0±0.5
Precautions for use	This product is inert gas anti-static packaging, it should be sealed and stored in a dry and cool environment.
Quality Level	200
Shipping	Ambient Temperature
Solvent	Isopropyl Alcohol (IPA), Monoethylene Glycol (MEG), Isophorone (IPN), or Terpineol (TPO)

Overview

Description

Nano-copper colloidal particles are widely used in catalysis, magnetic fluid, lubrication and other fields because of their specific physical and chemical properties. Nano copper powder and colloidal copper are prepared by variable current laser ion beam gas phase method, which has large industrial output, spherical shape, uniform particle size, high crystallinity, high product purity, high surface activity, easy to disperse and industrial application.

Features

·Evenly dispersed, small particles
·Good compatibility, easy to disperse, easy to add a variety of systems
·Good system stability, reliable performance, safety and environmental protection
·High specific surface area, high loading, easy surface functionalization

Application

·Production of Microelectronic Devices
·Catalyst in the reaction process of carbon dioxide and hydrogen to methanol
·Conductive coating treatment on metal and non-metal surfaces
·Conductive paste, used as petroleum lubricant and pharmaceutical industry

Case Study

Study on the Conductive Mechanism of Copper Nanoparticle Ink

Yang W, et al. Journal of Materials Science: Materials in Electronics, 2013, 24, 5175-5182.

A high-throughput method for the synthesis of copper nanoparticles (Cu NPs) in ethanol solutions was developed. 2 g of the obtained Cu NPs were dispersed in 8 mL of medium containing terpineol, ethanol, and lactic acid (3%), and then ultrasonicated for 1 hour to prepare nanocopper conductive ink (20 wt%). This copper nanoparticle ink can easily form a good conductive film on a glass slide at 300 °C. The effects of various factors on the formation and conductive mechanism of copper ink nanocopper films were studied.
Conductive mechanism of the copper ink
· Before the heating, the nanocopper particles distributed in the films were coated by organic molecules (PVP, oleic acid and terpineol) with a small contact area, thus the resistance was relatively high.
· After the heat-treatment, organic molecules were decomposed and volatilized and the growth of copper particles and densification of the film resulted in the improvement of the contact area a and an enlarged diameter of the contact spot d.
· Moreover, the thickness l of the PVP insulated layer separating the copper particles or the space between copper particles was decreased as a result of desorption of PVP, which made the quantum tunneling effect occur and enable electrons across the gap between adjacent copper particles through thermal vibration to form electron paths, so conductive efficiency can be enhanced greatly.