Copper Nanoparticles Ink (Cu, Purity: 99.9 %, Diameter: <100 nm)

Typical Properties
CAS	7440-50-8
Catalog	ACM7440508-75
Molecular Weight	63.55 g/mol
Boiling Point	2580 °C
Melting Point	1083.4 °C(lit.)
Flash Point	-23 °C
Purity	99.9 %
Density	8.92 g/cm3
Appearance	Liquid
Color	Dark red
Composition	Cu
Concentration	50/65 wt.%
Diameter	<100 nm
pH	7.0±0.5
Precautions for use	This product is inert gas anti-static packaging, it should be sealed and stored in a dry and cool environment.
Quality Level	200
Shipping	Ambient Temperature
Solvent	Isopropyl Alcohol (IPA), Monoethylene Glycol (MEG), Isophorone (IPN), or Terpineol (TPO)

Overview

Description

Nano-copper colloidal particles are widely used in catalysis, magnetic fluid, lubrication and other fields because of their specific physical and chemical properties. Nano copper powder and colloidal copper are prepared by variable current laser ion beam gas phase method, which has large industrial output, spherical shape, uniform particle size, high crystallinity, high product purity, high surface activity, easy to disperse and industrial application.

Features

·Evenly dispersed, small particles
·Good compatibility, easy to disperse, easy to add a variety of systems
·Good system stability, reliable performance, safety and environmental protection
·High specific surface area, high loading, easy surface functionalization

Application

·Production of Microelectronic Devices
·Catalyst in the reaction process of carbon dioxide and hydrogen to methanol
·Conductive coating treatment on metal and non-metal surfaces
·Conductive paste, used as petroleum lubricant and pharmaceutical industry