Copper Nanoparticles Dispersion (Cu, Purity: 99.9%, Diameter: <80nm)

Typical Properties
CAS	7440-50-8
Catalog	ACM7440508-74
Molecular Weight	63.55 g/mol
Boiling Point	2580 °C
Melting Point	1083.4 °C(lit.)
Flash Point	-23 °C
Purity	99.9 %
Density	8.92 g/cm3
Appearance	Liquid
Storage	2-8 °C
Color	Black
Composition	Cu
Concentration	< 5 % (Available as per Customer requirement)
Diameter	<80 nm
pH	7.0±0.5
Precautions for use	This product is inert gas anti-static packaging, it should be sealed and stored in a dry and cool environment.
Quality Level	200
Shipping	Ambient Temperature
Solvent	Organic Solvent (DMF), IPA Ethanol, Water (ddH19O)

Overview

Description

Nano-copper colloidal particles are widely used in catalysis, magnetic fluid, lubrication and other fields because of their specific physical and chemical properties. Nano copper powder and colloidal copper are prepared by variable current laser ion beam gas phase method, which has large industrial output, spherical shape, uniform particle size, high crystallinity, high product purity, high surface activity, easy to disperse and industrial application.

Features

·Evenly dispersed, small particles
·Good compatibility, easy to disperse, easy to add a variety of systems
·Good system stability, reliable performance, safety and environmental protection
·High specific surface area, high loading, easy surface functionalization

Application

·Production of Microelectronic Devices
·Catalyst in the reaction process of carbon dioxide and hydrogen to methanol
·Conductive coating treatment on metal and non-metal surfaces
·Conductive paste, used as petroleum lubricant and pharmaceutical industry

Case Study

Size-Controllable Copper Nanoparticles for Flexible Printed Electronics

Zhang Y, et al. Journal of materials science, 2018, 53, 12988-12995.

Copper material is particularly suitable for use in conductive inks due to its low cost and high conductivity. For example, the prepared high-purity monodisperse copper nanoparticles (Cu NPs) can be dispersed in ink mixtures with appropriate viscosity, flowability, and printability. Different conductive pattern layers can be obtained by screen printing copper-based inks onto flexible substrates and then annealing them.
Preparation of Cu NPs-based conductive ink and pattern
· Size-controlled Cu NPs were first prepared through a polyol process using ascorbic acid as a reducing agent. During the preparation process, the size of the nanoparticles was adjusted by adjusting the amounts of copper source and reducing agent.
· Cu NPs with different particle sizes were dispersed into several kinds of oil solvents containing ethylene glycol butyl ether, polyethylene glycol, hydroxyethyl cellulose, and other additives. After gradual blending, a copper-based ink was prepared.
· Then, using this prepared ink, a conductive pattern layer was fabricated on a flexible polyimide (PI) substrate via screen printing. After heating at 240 °C (40 min) under N2 in an annealing furnace, the printed flexible patterns became highly conductive with an electrical resistivity of only 16.2 μΩ cm, which was close to that of bulk copper.