Copper Nanoparticle Dispersion (Cu, Purity: 99.9 %, Diameter: 50nm)

Typical Properties
CAS	7440-50-8
Catalog	ACM7440508-73
Molecular Weight	63.55 g/mol
Boiling Point	2580 °C
Melting Point	1083.4 °C(lit.)
Flash Point	-23 °C
Purity	99.9 %
Density	8.92 g/cm3
Appearance	Liquid
Storage	2-8 °C
Color	Black
Composition	Cu
Concentration	2-3 wt.% (Available as per Customer requirement)
Diameter	50 nm
pH	7.0±0.5
Precautions for use	For industrial catalysts, recommended dosage: ≥20ppm;
Quality Level	200
Shipping	Ambient Temperature
Solvent	Organic Solvent (DMF), IPA Ethanol, Water (ddH11O)

Overview

Description

Nano-copper colloidal particles are widely used in catalysis, magnetic fluid, lubrication and other fields because of their specific physical and chemical properties. Nano copper powder and colloidal copper are prepared by variable current laser ion beam gas phase method, which has large industrial output, spherical shape, uniform particle size, high crystallinity, high product purity, high surface activity, easy to disperse and industrial application.

Features

·Evenly dispersed, small particles
·Good compatibility, easy to disperse, easy to add a variety of systems
·Good system stability, reliable performance, safety and environmental protection
·High specific surface area, high loading, easy surface functionalization

Application

·Production of Microelectronic Devices
·Catalyst in the reaction process of carbon dioxide and hydrogen to methanol
·Conductive coating treatment on metal and non-metal surfaces
·Conductive paste, used as petroleum lubricant and pharmaceutical industry

Case Study

Application of Copper Nanoparticles in the Preparation of Flexible Electronic Products

Hong G B, et al. Nanomaterials, 2022, 12(3), 360.

Well-dispersed copper nanoparticles (CuNPs) can be further prepared into copper conductive inks for coating modification of flexible polyethylene terephthalate (PET) substrates. The copper ink-coated PET substrate was treated with formic acid aqueous solution and sintered at 130°C for 60 min, and a low resistivity of 1.67×10 -3 Ω ·cm could be obtained.
Preparation of PET flexible substrate treated with CuNPs
· Synthesis of CuNPs: CuNPs were synthesized by a reduction method using ascorbic acid as the reducing agent. Different reaction temperatures and reduction strategies were employed.
· PET substrate pretreatment: Use a mixture of deionized water, ammonia and sodium perchlorate to chemically treat the PET substrate.
· Preparation of Copper Conductive Ink: CuNPs were mixed with solvent, polymer matrix (2%) and humectant (1%), and then subjected to ultrasonic vibration for 30 minutes to form copper ink.
· Finally, copper conductive ink is coated on the pretreated PET substrate. The coated substrates were dried at low temperatures and sintered at 130°C for various durations, followed by the application of formic acid as a sintering aid.